Technology Strength – PCB Capability
Item name
|
Processing Capacity
|
Layer
|
Rigid: 1-68 Layer; ( FPC: 10 Layer; Rigid & Flex: 16 Layers )
|
Material
|
FR4,FR5,High-TG,Halogen Free, Rogers, Isola, Ceremic, Taconic, Arlon, Teflon, Aluminum board
|
Max size
|
646x1200mm
|
Contour tolerance
|
±0.10mm
|
Board thickness
|
0.2mm-6.0mm
|
Board thickness tolerance
|
±10%
|
Min line width
|
0.075mm
|
Min line space
|
0.075mm
|
Outer layer copper thickness
|
18um-210um(HOZ-6OZ)
|
Inner layer copper thickness
|
18um-210um(HOZ-6OZ)
|
Bit size
|
0.15mm-6.50mm
|
Finished hole size
|
0.1mm-6.0mm
|
Hole tolerance
|
±0.05mm
|
Hole position tolerance
|
±0.05mm
|
Laser drilling hole size
|
0.075mm
|
Aperture ratio
|
10:01
|
Solder mask color
|
Green, blue, white, black, red, yellow, purple etc
|
Min Soldermask bridge
|
0.050mm
|
Plug hole diameter
|
0.20mm-0.50mm
|
Impedance control tolerance
|
±10%
|
Surface treatment
|
Lead free HASL, immersion gold, golden finger, immersion tin, immersion silver, OSP, Carbon oil, plated hard gold(up to 100u")
|
Technology Strength – PCB Assembly Capability
Material Type
|
Item
|
MIN.
|
MAX.
|
PCB
|
Size(length*width*thickness)
|
50*40*0.38mm
|
510*460*4.2mm
|
Weight
|
N/A
|
1.8kg
|
Special size
|
610*510*4.2mm
|
Material
|
FR-4,CEM-1,CEM-3,Aluminum board,FPC
|
Surface treatment
|
HAL, OSP, Immersion gold, plated gold, golden finger
|
Electronic components
|
Chip and IC
|
0201(0.6*0.3) |
22*22
|
Special size(connector)
|
1.6*0.8
|
72mm
|
BGA pitch
|
0.3mm
|
1.0mm
|
QFP pitch
|
0.3mm
|
1.0mm
|
Prodcut Type
|
Product Quantity
|
Normal delivery time
|
The quickest delivery time
|
SMD+connect-to
|
5~200
|
6WD
|
3WD
|
201~2000
|
9WD
|
7WD
|
≥2000
|
12~15WD
|
10WD
|
SMD+DIP
|
5~200
|
6WD
|
4WD
|
201~2000
|
12WD
|
10WD
|
≥2000
|
20WD
|
15WD
|
Note 1.The above time does not include the PCB production, components purchase and PCB production can progress at the same time.
2.The above time does not include the assembly time, assembly need accounting time according to the particular case.
Technology Strength – PCB Assembly Capability
Dept.
|
Description
|
No. of Lines
|
Chips ( 10K/Day/Line)
|
Monthly Capacity
|
Grand Total/Monthly
|
Bulk Order Dept.
|
SMT Production Lines
|
4
|
300
|
31, 200
|
34,320
|
Samll Volume Dept.
|
SMT Production Lines
|
7
|
60
|
6,240
|
Samll Volume Dept.
|
SMT Production Lines
|
15
|
60
|
28,080
|
Bulk Order Dept.
|
DIP / Wave Soldering
|
6
|
40
|
6,200
|
12,600
|
Samll Volume Dept.
|
DIP / Wave Soldering
|
4
|
40
|
4,200
|
Samll Volume Dept.
|
DIP / Wave Soldering(ERSA Germany)
|
2
|
40
|
2,200
|
Bulk Order Dept.
|
Assembly Lines
|
2
|
35 K/ Day
|
1.96M/M
|
3.64M
|
Samll Volume Dept.
|
Assembly Lines(satic-free and dust-free)
|
4
|
35 K/ Day
|
1.68M/M
|